Author | : Bhutani, Akanksha |
Publisher | : KIT Scientific Publishing |
Total Pages | : 254 |
Release | : 2019-10-17 |
Genre | : Technology & Engineering |
ISBN | : 3731509458 |
Author | : Bhutani, Akanksha |
Publisher | : KIT Scientific Publishing |
Total Pages | : 254 |
Release | : 2019-10-17 |
Genre | : Technology & Engineering |
ISBN | : 3731509458 |
Author | : Kowalewski, Jerzy |
Publisher | : KIT Scientific Publishing |
Total Pages | : 182 |
Release | : 2020-06-08 |
Genre | : Technology & Engineering |
ISBN | : 3731509970 |
Author | : Li, Yueheng |
Publisher | : KIT Scientific Publishing |
Total Pages | : 246 |
Release | : 2024-02-23 |
Genre | : |
ISBN | : 373151334X |
Accompanied with the development of the wireless communication technologies, the high data traffic is more necessary for civil and industrial applications than ever The concept of an intelligent reflective surface (IRS) has attracted considerable attention recently as a low-cost solution. As the main contribution, the dissertation creates new state-of-the-art and formulates a solid milestone for the IRS research field.
Author | : Diewald, Axel |
Publisher | : KIT Scientific Publishing |
Total Pages | : 190 |
Release | : 2023-08-15 |
Genre | : |
ISBN | : 3731512963 |
Radar target simulators (RTSs) deceive a radar under test (RuT) by creating an artificial environment consisting of virtual radar targets. In this work, new techniques are presented that overcome the rasterization deficiency of current RTS systems and enable the generation of virtual targets at arbitrary high-precision positions. This allows for continuous movement of the targets and thus a more credible simulation environment.
Author | : Abadpour, Sevda |
Publisher | : KIT Scientific Publishing |
Total Pages | : 194 |
Release | : 2023-11-20 |
Genre | : |
ISBN | : 3731513161 |
During the evolvement of autonomous driving technology, obtaining reliable 3-D environmental information is an indispensable task in approaching safe driving. The operational behavior of automotive radars can be precisely evaluated in a virtual test environment by modeling its surrounding, specifically vulnerable road users (VRUs). Such a realistic model can be generated based on the radar cross section (RCS) and Doppler signatures of a VRU. Therefore, this work proposes a high-resolution RCS measurement technique to determine the relevant scattering points of different VRUs.
Author | : Ninos, Alexandros |
Publisher | : KIT Scientific Publishing |
Total Pages | : 164 |
Release | : 2022-10-27 |
Genre | : Technology & Engineering |
ISBN | : 3731512254 |
The aim of this work is the development of a Radar system for consumer applications. It is capable of tracking multiple people in a room and offers a touchless human-machine interface for purposes that range from entertainment to hygiene.
Author | : Mailadil T. Sebastian |
Publisher | : John Wiley & Sons |
Total Pages | : 997 |
Release | : 2017-03-02 |
Genre | : Technology & Engineering |
ISBN | : 1119208564 |
Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und bei intelligenten Transportsystemen der 5. Generation für eine höhere Nachfrage nach dielektrischen Materialien und modernen Fertigungstechniken. Diese Materialien bieten ausgezeichnete elektrische, dielektrische und thermische Eigenschaften und verfügen über enormes Potenzial, vor allem bei der drahtlosen Kommunikation, bei flexibler Elektronik und gedruckter Elektronik. Microwave Materials and Applications erläutert die herkömmlichen Methoden zur Messung der dielektrischen Eigenschaften im Mikrowellenbereich, die verschiedenen Ansätze zur Lösung von Problemen der Materialchemie und von Kristallstrukturen, in den Bereichen Doping, Substitution und Aufbau von Verbundwerkstoffen. Besonderer Schwerpunkt liegt auf Verarbeitungstechniken, Einflüssen der Morphologie und der Anwendung von Materialien in der Mikrowellentechnik. Gleichzeitig werden viele der jüngsten Forschungserkenntnisse bei Mikrowellen-Dielektrika und -Anwendungen zusammengefasst. Die verschiedenen Kapitel untersuchen: Oxidkeramiken für dielektrische Resonatoren und Substrate, HTCC-, LTCC- und ULTCC-Bänder für Substrate, Polymer-Keramik-Verbundstoffe für Leiterplatten, Elastomer-Keramik-Verbundstoffe für flexible Elektronik, dielektrische Tinten, Materialien für die EMV-Abschirmung, Mikrowellen-Ferrite. Ein umfassender Anhang präsentiert die grundlegenden Eigenschaften von mehr als 4000 verlustarmen dielektrischen Keramiken, deren Zusammensetzung, kristalline Struktur und dielektrischen Eigenschaften für Mikrowellenanwendungen. Microwave Materials and Applications wirft einen Blick auf sämtliche Aspekte von Mikrowellenmaterialien und -anwendungen, ein nützliches Handbuch für Wissenschaftler, Unternehmen, Ingenieure und Studenten, die sich mit heutigen und neuen Anwendungen in den Bereichen drahtlose Kommunikation und Unterhaltungselektronik beschäftigen.
Author | : Ken Kuang |
Publisher | : Springer Science & Business Media |
Total Pages | : 295 |
Release | : 2009-12-01 |
Genre | : Technology & Engineering |
ISBN | : 1441909842 |
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Author | : Duixian Liu |
Publisher | : John Wiley & Sons |
Total Pages | : 850 |
Release | : 2009-03-03 |
Genre | : Technology & Engineering |
ISBN | : 9780470742952 |
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging